Non-Display technology Xray sensor FingerPrint Sensor Flat Panel Antenna FOPLP FOPLP fan-out panel-level packageQunchuang Optoelectronics has proposed an unprecedented concept for the first time: "Panel Semiconductor". Among them, advanced packaging technology that can highly integrate chips has become one of the important directions for Qunchuang to develop cross-border semiconductor industry, and has joined hands with partners such as IC Design House and OSAT to carry out heterogeneous integration technology innovation.Qunchuang will first activate the existing G3.5 production line, and develop a medium- and high-order semiconductor package with a line width of 2μm ~ 10μm with a Glass Panel with a maximum size of G3.5 FOPLP (620mm X 750mm) with a line width of 2μm ~ 10μm, with an area of 7 times that of 300mm Glass Wafer (as shown in the figure below). Currently, the Warpage problem has been overcome in the development of FOPLP technology. Coupled with the high glass utilization rate of square shapes, we can give full play to the technical advantages of "accommodating more I/O", "smaller size", "more effective", and "saving power consumption", and further provide customers with more competitive costs and creating greater profit value.In the future, we will look more at the combination of FOPLP technology and automotive panel displays, and open up a new pattern by vertically integrating the supply chain.G3.5 FOPLP Glass Panel Production area
Qunchuang Optoelectronics has proposed an unprecedented concept for the first time: "Panel Semiconductor". Among them, advanced packaging technology that can highly integrate chips has become one of the important directions for Qunchuang to develop cross-border semiconductor industry, and has joined hands with partners such as IC Design House and OSAT to carry out heterogeneous integration technology innovation.
Qunchuang will first activate the existing G3.5 production line, and develop a medium- and high-order semiconductor package with a line width of 2μm ~ 10μm with a Glass Panel with a maximum size of G3.5 FOPLP (620mm X 750mm) with a line width of 2μm ~ 10μm, with an area of 7 times that of 300mm Glass Wafer (as shown in the figure below). Currently, the Warpage problem has been overcome in the development of FOPLP technology. Coupled with the high glass utilization rate of square shapes, we can give full play to the technical advantages of "accommodating more I/O", "smaller size", "more effective", and "saving power consumption", and further provide customers with more competitive costs and creating greater profit value.
G3.5 FOPLP Glass Panel Production area
